Vol. 2013, Issue 1, 2013January 01, 2013 EDT
LORD SolderBrace™ Wafer Applied Coating for Improved Reliability and Throughput in WLCSP
LORD SolderBrace™ Wafer Applied Coating for Improved Reliability and Throughput in WLCSP
Sears, George, Guoyun Tian, Duy Le, and Heather Bradley. 2013. “LORD SolderBraceTM Wafer Applied Coating for Improved Reliability and Throughput in WLCSP.” IMAPSource Proceedings 2013 (1): 55–60. https://doi.org/10.4071/isom-2013-TA25.