Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Small-chip Attachment on Copper Leadframe with Sintered Nanosilver Paste

Jesus N. Calata, Hanguang Zheng, Guo-Quan Lu, Khai Ngo, Luu Nguyen,
Anti-tarnish coating copper leadframe nanosilver paste sintered silver attachment
• https://doi.org/10.4071/isom-2013-TA32
IMAPSource Conference Papers
Calata, Jesus N., Hanguang Zheng, Guo-Quan Lu, Khai Ngo, and Luu Nguyen. 2013. “Small-Chip Attachment on Copper Leadframe with Sintered Nanosilver Paste.” IMAPSource Proceedings 2013 (1): 72–77. https://doi.org/10.4071/isom-2013-TA32.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system