Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Flip-chip Packages with Periphery Cu Pillar Bumps as Wire Bond Replacement—Design, Modeling & Characterization
Flip-chip Packages with Periphery Cu Pillar Bumps as Wire Bond Replacement—Design, Modeling & Characterization
Li, Zhe, Siow Chek Tan, Yee Huan Yew, Pheak Ti Teh, MJ Lee, and John Xie. 2013. “Flip-Chip Packages with Periphery Cu Pillar Bumps as Wire Bond Replacement—Design, Modeling & Characterization.” IMAPSource Proceedings 2013 (1): 235–235. https://doi.org/10.4071/isom-2013-TP21.