Vol. 2013, Issue 1, 2013January 01, 2013 EDT
DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATION
DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATION
Parès, G., A. Attard, F. Dosseul, A. N’Hari, O. Boillon, L. Toffanin, G. Klug, and G. Simon. 2013. “DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATION.” IMAPSource Proceedings 2013 (1): 516–22. https://doi.org/10.4071/isom-2013-WA41.