A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Ming Hu; Lee Kresge; Ning-Cheng Lee

doi:10.4071/isom-2013-THP34

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Hu, Ming, Lee Kresge, and Ning-Cheng Lee. 2013. “A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP.” IMAPSource Proceedings 2013 (1): 853–60. https://doi.org/10.4071/isom-2013-THP34.

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