Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration
Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration
Lau, J. H., H. C. Chien, S. T. Wu, Y. L. Chao, W. C. Lo, and M. J. Kao. 2013. “Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration.” IMAPSource Proceedings 2013 (1): 389–96. https://doi.org/10.4071/isom-2013-TP61.