Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment

Jia-Shen Lan; Mei-Ling Wu

doi:10.4071/isom-2013-TP24

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Lan, Jia-Shen, and Mei-Ling Wu. 2013. “Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment.” IMAPSource Proceedings 2013 (1): 250–59. https://doi.org/10.4071/isom-2013-TP24.

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