Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment
Jia-Shen Lan
,
Mei-Ling Wu
,
Ball Grid Array Package
Finite Element Method
Fatigue Life
Mechanical Bending
Solder Joint
•
https://doi.org/10.4071/isom-2013-TP24
IMAPSource Conference Papers
Lan, Jia-Shen, and Mei-Ling Wu. 2013. “Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment.”
IMAPSource Proceedings
2013 (1): 250–59.
https://doi.org/10.4071/isom-2013-TP24
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats