Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment
Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment
Lan, Jia-Shen, and Mei-Ling Wu. 2013. “Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment.” IMAPSource Proceedings 2013 (1): 250–59. https://doi.org/10.4071/isom-2013-TP24.