Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders
Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders
George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. 2013. “Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders.” IMAPSource Proceedings 2013 (1): 120–27. https://doi.org/10.4071/isom-2013-TA45.