Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders

Elviz George; Michael Osterman; Michael Pecht; Richard Coyle; Richard Parker; Elizabeth Benedetto

doi:10.4071/isom-2013-TA45

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George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. 2013. “Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders.” IMAPSource Proceedings 2013 (1): 120–27. https://doi.org/10.4071/isom-2013-TA45.

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