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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Anti-Counterfeit, Advanced Microelectronics Packaging Solutions for Miniaturized Medical Devices
Rabindra N. Das
,
Frank D. Egitto
,
How Lin
,
Anti-counterfeit
advanced packaging
medical device
high density interconnect (HDI)
System-in-Package (SiP)
•
https://doi.org/10.4071/isom-2013-TA54
IMAPSource Conference Papers
Das, Rabindra N., Frank D. Egitto, and How Lin. 2013. “Anti-Counterfeit, Advanced Microelectronics Packaging Solutions for Miniaturized Medical Devices.”
IMAPSource Proceedings
2013 (1): 158–65.
https://doi.org/10.4071/isom-2013-TA54
.
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