Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint

Hao Zhang; Qing-Sheng Zhu; Zhi-Quan Liu; Li Zhang; Hongyan Guo; Chi-Ming Lai

doi:10.4071/isom-2013-TA43

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Zhang, Hao, Qing-Sheng Zhu, Zhi-Quan Liu, Li Zhang, Hongyan Guo, and Chi-Ming Lai. 2013. “Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joint.” IMAPSource Proceedings 2013 (1): 109–14. https://doi.org/10.4071/isom-2013-TA43.

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