Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint
Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint
Zhang, Hao, Qing-Sheng Zhu, Zhi-Quan Liu, Li Zhang, Hongyan Guo, and Chi-Ming Lai. 2013. “Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joint.” IMAPSource Proceedings 2013 (1): 109–14. https://doi.org/10.4071/isom-2013-TA43.