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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint

Hao Zhang, Qing-Sheng Zhu, Zhi-Quan Liu, Li Zhang, Hongyan Guo, Chi-Ming Lai,
Fe-Ni alloyUBMIMCReliabilityHigh temperature storageTemperature cycling
https://doi.org/10.4071/isom-2013-TA43
IMAPSource Conference Papers
Zhang, Hao, Qing-Sheng Zhu, Zhi-Quan Liu, Li Zhang, Hongyan Guo, and Chi-Ming Lai. 2013. “Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joint.” IMAPSource Proceedings 2013 (1): 109–14. https:/​/​doi.org/​10.4071/​isom-2013-TA43.
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