Cu Heavy Wirebonding for High Power Device Interconnection

Baik-Woo Lee; Chang-Sik Kim; Changmo Jeong; Younghun Byun; Jeong-Won Yoon; Che-Heung Kim; Seong Woon Booh; U-in Chung

doi:10.4071/isom-2013-TP43

Lee, Baik-Woo, Chang-Sik Kim, Changmo Jeong, Younghun Byun, Jeong-Won Yoon, Che-Heung Kim, Seong Woon Booh, and U-in Chung. 2013. “Cu Heavy Wirebonding for High Power Device Interconnection.” IMAPSource Proceedings 2013 (1): 318–23. https://doi.org/10.4071/isom-2013-TP43.

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