Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Cu Heavy Wirebonding for High Power Device Interconnection
Cu Heavy Wirebonding for High Power Device Interconnection
Lee, Baik-Woo, Chang-Sik Kim, Changmo Jeong, Younghun Byun, Jeong-Won Yoon, Che-Heung Kim, Seong Woon Booh, and U-in Chung. 2013. “Cu Heavy Wirebonding for High Power Device Interconnection.” IMAPSource Proceedings 2013 (1): 318–23. https://doi.org/10.4071/isom-2013-TP43.