Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Zeiser, Roderich, Suleman Ayub, Jochen Hempel, Michael Berndt, and Juergen Wilde. 2013. “Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures.” IMAPSource Proceedings 2013 (1): 723–28. https://doi.org/10.4071/isom-2013-WP45.