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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration

Zidong Wang, Michael Gallagher, Kevin Wang, Elissei Iagodkine, Mark Oliver, Joe Lachowski, Greg Prokopowicz, Eric Huenger, Raymond Thibault, Zhifeng Bai, Christopher Tucker, Matthew Bishop, Scott Kisting, Lynne Mills, David Louks,
Stress buffer layerPatternable dielectricLow copper driftBenzocyclobutene
https://doi.org/10.4071/isom-2013-TA31
IMAPSource Conference Papers
Wang, Zidong, Michael Gallagher, Kevin Wang, Elissei Iagodkine, Mark Oliver, Joe Lachowski, Greg Prokopowicz, et al. 2013. “Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration.” IMAPSource Proceedings 2013 (1): 67–71. https:/​/​doi.org/​10.4071/​isom-2013-TA31.
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