Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration
Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration
Wang, Zidong, Michael Gallagher, Kevin Wang, Elissei Iagodkine, Mark Oliver, Joe Lachowski, Greg Prokopowicz, et al. 2013. “Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV Integration.” IMAPSource Proceedings 2013 (1): 67–71. https://doi.org/10.4071/isom-2013-TA31.
Powered by Scholastica, the modern academic journal management system