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ISSN 2380-4505
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Improvement of Back-Side Cosmetic Defects And Wafer Strength

Victoria L. Calero-DdelC, Irene Popova, Aaron Bicknell, Richard Indyk, Joe Sullivan, John Fitzsimmons,
Silicon wet etchfailure stressdie failure strengthwafer back-side
https://doi.org/10.4071/isom-2013-WP27
IMAPSource Conference Papers
Calero-DdelC, Victoria L., Irene Popova, Aaron Bicknell, Richard Indyk, Joe Sullivan, and John Fitzsimmons. 2013. “Improvement of Back-Side Cosmetic Defects And Wafer Strength.” IMAPSource Proceedings 2013 (1): 672–77. https:/​/​doi.org/​10.4071/​isom-2013-WP27.

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