DIMM-in-a-PACKAGE (DIAP) signal integrity for high-performance on-board memory applications

Zhuowen Sun; Kevin Chen; Richard Crisp

doi:10.4071/isom-2013-TP12

Sun, Zhuowen, Kevin Chen, and Richard Crisp. 2013. “DIMM-in-a-PACKAGE (DIAP) Signal Integrity for High-Performance on-Board Memory Applications.” IMAPSource Proceedings 2013 (1): 223–27. https://doi.org/10.4071/isom-2013-TP12.

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DIMM-in-a-PACKAGE (DIAP) signal integrity for high-performance on-board memory applications

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