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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

High Temperature Sintered Interconnects Formed by Transient Liquid Phase Sintering

Hannes Greve, F. Patrick McCluskey,
Transient Liquid Phase Sintering (TLPS)Solid-Liquid Interface Diffusion (SLID)High Temperature ElectronicsInterconnectsMechanical TestingLead Free Solder
https://doi.org/10.4071/isom-2013-THP62
IMAPSource Conference Papers
Greve, Hannes, and F. Patrick McCluskey. 2013. “High Temperature Sintered Interconnects Formed by Transient Liquid Phase Sintering.” IMAPSource Proceedings 2013 (1): 951–56. https:/​/​doi.org/​10.4071/​isom-2013-THP62.

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