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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
High Temperature Sintered Interconnects Formed by Transient Liquid Phase Sintering
Hannes Greve
,
F. Patrick McCluskey
,
Transient Liquid Phase Sintering (TLPS)
Solid-Liquid Interface Diffusion (SLID)
High Temperature Electronics
Interconnects
Mechanical Testing
Lead Free Solder
•
https://doi.org/10.4071/isom-2013-THP62
IMAPSource Conference Papers
Greve, Hannes, and F. Patrick McCluskey. 2013. “High Temperature Sintered Interconnects Formed by Transient Liquid Phase Sintering.”
IMAPSource Proceedings
2013 (1): 951–56.
https://doi.org/10.4071/isom-2013-THP62
.
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