Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2018, Issue S1, 2018
October 01, 2018 EDT
Bridging the Gaps
Tien Wu
,
inhomogeneous integration
future packaging technologies
design concepts
•
https://doi.org/10.4071/2380-4505.2018.1.000001
IMAPSource Conference Papers
Wu, Tien. 2018. “Bridging the Gaps.”
IMAPSource Proceedings
2018 (S1): 1–13.
https://doi.org/10.4071/2380-4505.2018.1.000001
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
