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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Advanced Packaging for Automotive Dashboard Application
Nokibul Islam
,
HC Choi
,
Automotive
wirebond
flip chip
fan-out
reliability
dashboard
•
https://doi.org/10.4071/2380-4505-2018.1.000452
IMAPSource Conference Papers
Islam, Nokibul, and HC Choi. 2018. “Advanced Packaging for Automotive Dashboard Application.”
IMAPSource Proceedings
2018 (1): 452–57.
https://doi.org/10.4071/2380-4505-2018.1.000452
.
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