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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Advanced Build-up Materials for High Speed Transmission Application
Shiro Tatsumi
,
Shohei Fujishima
,
Hiroyuki Sakauchi
,
Insulation build-up materials
semi-additive process
low dielectric loss tangent
Cu surface roughness and Young's modulus
•
https://doi.org/10.4071/2380-4505-2018.1.000305
IMAPSource Conference Papers
Tatsumi, Shiro, Shohei Fujishima, and Hiroyuki Sakauchi. 2018. “Advanced Build-up Materials for High Speed Transmission Application.”
IMAPSource Proceedings
2018 (1): 305–9.
https://doi.org/10.4071/2380-4505-2018.1.000305
.
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