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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Study on high temperature resistant die bonding formed by Al/Ni nano-particles composite paste

Yasunori Tanaka, Tatsumasa Wakata, Norihiro Murakawa, Tomonori Iizuka, Kohei Tatsumi,
SiC Power DevicesAl/Ni nano-particles composite pasteHigh temperature resistantDie bonding Stress relaxation structure
https://doi.org/10.4071/2380-4505-2018.1.000442
IMAPSource Conference Papers
Tanaka, Yasunori, Tatsumasa Wakata, Norihiro Murakawa, Tomonori Iizuka, and Kohei Tatsumi. 2018. “Study on High Temperature Resistant Die Bonding Formed by Al/Ni Nano-Particles Composite Paste.” IMAPSource Proceedings 2018 (1): 442–46. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000442.
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