Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Ultra-Fine Pitch Wedge bonding for Device Reliability Characterization
Ultra-Fine Pitch Wedge bonding for Device Reliability Characterization
Lacey L. Badger, Nikholas G. Toledo, Derek W. Slottke, John Thomas, Miguel Alamillo, Elliott Gunnarsson, Mark L. Le Rutt, Ilan Tsameret,
Badger, Lacey L., Nikholas G. Toledo, Derek W. Slottke, John Thomas, Miguel Alamillo, Elliott Gunnarsson, Mark L. Le Rutt, and Ilan Tsameret. 2018. “Ultra-Fine Pitch Wedge Bonding for Device Reliability Characterization.” IMAPSource Proceedings 2018 (1): 561–65. https://doi.org/10.4071/2380-4505-2018.1.000561.