Ultra-Fine Pitch Wedge bonding for Device Reliability Characterization

Lacey L. Badger; Nikholas G. Toledo; Derek W. Slottke; John Thomas; Miguel Alamillo; Elliott Gunnarsson; Mark L. Le Rutt; Ilan Tsameret

doi:10.4071/2380-4505-2018.1.000561

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Badger, Lacey L., Nikholas G. Toledo, Derek W. Slottke, John Thomas, Miguel Alamillo, Elliott Gunnarsson, Mark L. Le Rutt, and Ilan Tsameret. 2018. “Ultra-Fine Pitch Wedge Bonding for Device Reliability Characterization.” IMAPSource Proceedings 2018 (1): 561–65. https://doi.org/10.4071/2380-4505-2018.1.000561.

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