Warpage Behaviors of System-in-Packages on a Substrate Strip

Eric Ouyang; Billy Ahn; SeonMo Gu; Jim Hsu; Yonghyuk Jeong; JaeMyong Kim; Susan Lin; Goran Liu; Anthony Yang

doi:10.4071/2380-4505-2018.1.000344

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Ouyang, Eric, Billy Ahn, SeonMo Gu, Jim Hsu, Yonghyuk Jeong, JaeMyong Kim, Susan Lin, Goran Liu, and Anthony Yang. 2018. “Warpage Behaviors of System-in-Packages on a Substrate Strip.” IMAPSource Proceedings 2018 (1): 344–48. https://doi.org/10.4071/2380-4505-2018.1.000344.

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