Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications

Jie Geng; Hongwen Zhang; Francis Mutuku; Ning-Cheng Lee

doi:10.4071/2380-4505-2018.1.000075

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Geng, Jie, Hongwen Zhang, Francis Mutuku, and Ning-Cheng Lee. 2018. “Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications.” IMAPSource Proceedings 2018 (1): 75–83. https://doi.org/10.4071/2380-4505-2018.1.000075.

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