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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Fine line panel level fan out changes the SiP landscape
David Fang
,
Michael Hsu
,
CC Chang
,
KW Chung
,
Alex Liu
,
Irving Lin
,
Daniel Fann
,
Advanced packaging
system in package
heterogeneous integration
panel level fan out
fine line RDL
•
https://doi.org/10.4071/2380-4505-2018.1.000349
IMAPSource Conference Papers
Fang, David, Michael Hsu, CC Chang, KW Chung, Alex Liu, Irving Lin, and Daniel Fann. 2018. “Fine Line Panel Level Fan out Changes the SiP Landscape.”
IMAPSource Proceedings
2018 (1): 349–54.
https://doi.org/10.4071/2380-4505-2018.1.000349
.
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