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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Fine line panel level fan out changes the SiP landscape

David Fang, Michael Hsu, CC Chang, KW Chung, Alex Liu, Irving Lin, Daniel Fann,
Advanced packaging system in package heterogeneous integration panel level fan out fine line RDL
• https://doi.org/10.4071/2380-4505-2018.1.000349
IMAPSource Conference Papers
Fang, David, Michael Hsu, CC Chang, KW Chung, Alex Liu, Irving Lin, and Daniel Fann. 2018. “Fine Line Panel Level Fan out Changes the SiP Landscape.” IMAPSource Proceedings 2018 (1): 349–54. https://doi.org/10.4071/2380-4505-2018.1.000349.
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