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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Applicability of Selective Laser Reflow for Thin Die Stacking

Luke A. Wentlent, James Wilcox, Mohammed Genanu,
Laser Reflow Flip Chip Interconnect Pb-free Bonding
• https://doi.org/10.4071/2380-4505-2018.1.000741
IMAPSource Conference Papers
Wentlent, Luke A., James Wilcox, and Mohammed Genanu. 2018. “Applicability of Selective Laser Reflow for Thin Die Stacking.” IMAPSource Proceedings 2018 (1): 741–47. https://doi.org/10.4071/2380-4505-2018.1.000741.
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