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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Applicability of Selective Laser Reflow for Thin Die Stacking
Luke A. Wentlent
,
James Wilcox
,
Mohammed Genanu
,
Laser Reflow
Flip Chip
Interconnect
Pb-free
Bonding
•
https://doi.org/10.4071/2380-4505-2018.1.000741
IMAPSource Conference Papers
Wentlent, Luke A., James Wilcox, and Mohammed Genanu. 2018. “Applicability of Selective Laser Reflow for Thin Die Stacking.”
IMAPSource Proceedings
2018 (1): 741–47.
https://doi.org/10.4071/2380-4505-2018.1.000741
.
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