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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

New Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and High Reliability

Daichi Okamoto, Yoko Shibasaki, Daisuke Shibata, Tadahiko Hanada,
dielectric materialsreliabilityhigh-density substrateinterposerfan-out package
https://doi.org/10.4071/2380-4505-2018.1.000466
IMAPSource Conference Papers
Okamoto, Daichi, Yoko Shibasaki, Daisuke Shibata, and Tadahiko Hanada. 2018. “New Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and High Reliability.” IMAPSource Proceedings 2018 (1): 466–69. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000466.
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