A New Method for Non-Destructive Characterization of Through Holes in Printed Circuit Boards

Sarah Czaplewski; Joe Doman; Joe Kuczynski

doi:10.4071/2380-4505-2018.1.000589

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Czaplewski, Sarah, Joe Doman, and Joe Kuczynski. 2018. “A New Method for Non-Destructive Characterization of Through Holes in Printed Circuit Boards.” IMAPSource Proceedings 2018 (1): 589–95. https://doi.org/10.4071/2380-4505-2018.1.000589.

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