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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Thermal Characterization and Simulation of a fcBGA-H device

Eric Ouyang, Weikun He, YongHyuk Jeong, MyoungSu Chae, SeonMo Gu, Gwang Kim, Billy Ahn,
TIM thermal resistance junction temperature flip chip structure function
• https://doi.org/10.4071/isom-2012-WP22
IMAPSource Conference Papers
Ouyang, Eric, Weikun He, YongHyuk Jeong, MyoungSu Chae, SeonMo Gu, Gwang Kim, and Billy Ahn. 2012. “Thermal Characterization and Simulation of a fcBGA-H Device.” IMAPSource Proceedings 2012 (1): 809–17. https://doi.org/10.4071/isom-2012-WP22.
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