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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Thermal Characterization and Simulation of a fcBGA-H device
Eric Ouyang
,
Weikun He
,
YongHyuk Jeong
,
MyoungSu Chae
,
SeonMo Gu
,
Gwang Kim
,
Billy Ahn
,
TIM
thermal resistance
junction temperature
flip chip
structure function
•
https://doi.org/10.4071/isom-2012-WP22
IMAPSource Conference Papers
Ouyang, Eric, Weikun He, YongHyuk Jeong, MyoungSu Chae, SeonMo Gu, Gwang Kim, and Billy Ahn. 2012. “Thermal Characterization and Simulation of a fcBGA-H Device.”
IMAPSource Proceedings
2012 (1): 809–17.
https://doi.org/10.4071/isom-2012-WP22
.
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