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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Handling technology for 0.075-square mm powder IC chip
Hideyuki Noda
,
Powder IC chip
Double-surface-electrode
Water-based handling
Micropipette
Self-aligned positioning
•
https://doi.org/10.4071/isom-2012-WP62
IMAPSource Conference Papers
Noda, Hideyuki. 2012. “Handling Technology for 0.075-Square Mm Powder IC Chip.”
IMAPSource Proceedings
2012 (1): 975–83.
https://doi.org/10.4071/isom-2012-WP62
.
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