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ISSN 2380-4505
Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

A Novel Wafer-Level Double Side Packaging and Its Microwave Performance

Xiao Chen, Jiajie Tang, Gaowei Xu, Le Luo,
Novel Wafer-Level Double Side PackagingMicrowave Performancesystem-in-packageSiPthrough silicon viaTSVBCBmultilayersMSL
https://doi.org/10.4071/isom-2012-TA17
IMAPSource Conference Papers
Chen, Xiao, Jiajie Tang, Gaowei Xu, and Le Luo. 2012. “A Novel Wafer-Level Double Side Packaging and Its Microwave Performance.” IMAPSource Proceedings 2012 (1): 40–45. https:/​/​doi.org/​10.4071/​isom-2012-TA17.

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