Ultra-fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level Fabrication

Masaya Toba; Kazuyuki Mitsukura; Yoshinori Ejiri; Tomonori Minegishi; Kazuhiko Kurafuchi

doi:10.4071/isom-2017-THP41_007

Loading [Contrib]/a11y/accessibility-menu.js

Toba, Masaya, Kazuyuki Mitsukura, Yoshinori Ejiri, Tomonori Minegishi, and Kazuhiko Kurafuchi. 2017. “Ultra-Fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level Fabrication.” IMAPSource Proceedings 2017 (1): 742–46. https://doi.org/10.4071/isom-2017-THP41_007.

View more stats