Wire Bonding Looping Solutions for High Density System-in-Package (SiP)

Basil Milton; Odal Kwon; Cuong Huynh; Ivy Qin; Bob Chylak

doi:10.4071/isom-2017-WP41_151

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Milton, Basil, Odal Kwon, Cuong Huynh, Ivy Qin, and Bob Chylak. 2017. “Wire Bonding Looping Solutions for High Density System-in-Package (SiP).” IMAPSource Proceedings 2017 (1): 426–31. https://doi.org/10.4071/isom-2017-WP41_151.

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