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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

The Relevance of Low Temperature Co-fired Ceramic Module Packaging in the 5G Market

Ton Schless,
LTCC5GMicrowaveAntennaT/R moduleCore-shellmetal engineering
https://doi.org/10.4071/isom-2017-WP31_147
IMAPSource Conference Papers
Schless, Ton. 2017. “The Relevance of Low Temperature Co-Fired Ceramic Module Packaging in the 5G Market.” IMAPSource Proceedings 2017 (1): 773–78. https:/​/​doi.org/​10.4071/​isom-2017-WP31_147.
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