Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging
Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging
Palesko, Chet, and Amy Lujan. 2017. “Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging.” IMAPSource Proceedings 2017 (1): 721–26. https://doi.org/10.4071/isom-2017-THP32_050.