Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:54686/feed
Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

3D IPD on Thru Glass Via Substrate using panel Manufacturing Technology

Takamasa Takano, Satoru Kuramochi, Hobie Yun,
3D IPDTGVMIM capacitorsilicon nitridecapacitance density3D inductorQ-factor
https://doi.org/10.4071/isom-2017-TP41_060
IMAPSource Conference Papers
Takano, Takamasa, Satoru Kuramochi, and Hobie Yun. 2017. “3D IPD on Thru Glass Via Substrate Using Panel Manufacturing Technology.” IMAPSource Proceedings 2017 (1): 97–102. https:/​/​doi.org/​10.4071/​isom-2017-TP41_060.

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

cookies
cookies
cookies
Powered by Scholastica, the modern academic journal management system