Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Multichip Module Planarity Requirements Derived From Solder Surface Tension Models
Multichip Module Planarity Requirements Derived From Solder Surface Tension Models
Marinis, Thomas F., and Joseph W. Soucy. 2017. “Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.” IMAPSource Proceedings 2017 (1): 727–36. https://doi.org/10.4071/isom-2017-THP33_062.