Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Multichip Module Planarity Requirements Derived From Solder Surface Tension Models
Thomas F. Marinis
,
Joseph W. Soucy
,
Multichip Module
Substrate Warpage
Solder Bump
Surface Tension
•
https://doi.org/10.4071/isom-2017-THP33_062
IMAPSource Conference Papers
Marinis, Thomas F., and Joseph W. Soucy. 2017. “Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.”
IMAPSource Proceedings
2017 (1): 727–36.
https://doi.org/10.4071/isom-2017-THP33_062
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats