Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

Thomas F. Marinis; Joseph W. Soucy

doi:10.4071/isom-2017-THP33_062

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Marinis, Thomas F., and Joseph W. Soucy. 2017. “Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.” IMAPSource Proceedings 2017 (1): 727–36. https://doi.org/10.4071/isom-2017-THP33_062.

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