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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

Thomas F. Marinis, Joseph W. Soucy,
Multichip Module Substrate Warpage Solder Bump Surface Tension
• https://doi.org/10.4071/isom-2017-THP33_062
IMAPSource Conference Papers
Marinis, Thomas F., and Joseph W. Soucy. 2017. “Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.” IMAPSource Proceedings 2017 (1): 727–36. https://doi.org/10.4071/isom-2017-THP33_062.
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