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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Flip chip reliability and design rules for SIP module
Adrien Morard
,
Jean-Christophe Riou
,
Gabriel Pares
,
Copper-pillar
Flip chip
Mass reflow
System In Package
•
https://doi.org/10.4071/isom-2017-THP43_125
IMAPSource Conference Papers
Morard, Adrien, Jean-Christophe Riou, and Gabriel Pares. 2017. “Flip Chip Reliability and Design Rules for SIP Module.”
IMAPSource Proceedings
2017 (1): 754–60.
https://doi.org/10.4071/isom-2017-THP43_125
.
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