Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Bijan K. Tehrani; Ryan A. Bahr; Manos M. Tentzeris

doi:10.4071/isom-2017-WA36_162

Loading [Contrib]/a11y/accessibility-menu.js

Tehrani, Bijan K., Ryan A. Bahr, and Manos M. Tentzeris. 2017. “Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging.” IMAPSource Proceedings 2017 (1): 252–57. https://doi.org/10.4071/isom-2017-WA36_162.

View more stats