Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids
Youngtak Lee
,
Doug Link
,
Design of experiments
flip chip
lead free
surface mount devices
system-in-package
•
https://doi.org/10.4071/isom-2017-WA24_104
IMAPSource Conference Papers
Lee, Youngtak, and Doug Link. 2017. “Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids.”
IMAPSource Proceedings
2017 (1): 201–7.
https://doi.org/10.4071/isom-2017-WA24_104
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats