Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

Youngtak Lee; Doug Link

doi:10.4071/isom-2017-WA24_104

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Lee, Youngtak, and Doug Link. 2017. “Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids.” IMAPSource Proceedings 2017 (1): 201–7. https://doi.org/10.4071/isom-2017-WA24_104.

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