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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Thermal and Viscoelastic Properties of Underfill Using hexagonal Boron Nitride (hBN) Nanofiller

S. A. Razgaleh, Shyam Aravamudhan,
Hexagonal boron nitride (hBN) Microelectronics packaging Underfills Nanofillers Thermal properties Viscoelasticity Storage modulus (G′) Glass transition temperature (Tg)
• https://doi.org/10.4071/2380-4505-2017.THA25_047
IMAPSource Conference Papers
Razgaleh, S. A., and Shyam Aravamudhan. 2017. “Thermal and Viscoelastic Properties of Underfill Using Hexagonal Boron Nitride (hBN) Nanofiller.” IMAPSource Proceedings 2017 (1): 542–46. https://doi.org/10.4071/2380-4505-2017.THA25_047.
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