Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding
Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding
Nagao, Shijo, Hirofumi Fujita, Akio Shimoyama, Shinya Seki, Hao Zhang, and Katsuaki Suganuma. 2017. “Power Cycle Reliability of SiC Devices with Metal-Sinter Die-Attach and Thermostable Molding.” IMAPSource Proceedings 2017 (1): 8–12. https://doi.org/10.4071/isom-2017-TP12_024.