Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Direct sapphire to ceramic bonding for CMOS image sensor packaging using room temperature bonding technology
Direct sapphire to ceramic bonding for CMOS image sensor packaging using room temperature bonding technology
Lundén, H., A. Määttänen, and L. Murphy. 2017. “Direct Sapphire to Ceramic Bonding for CMOS Image Sensor Packaging Using Room Temperature Bonding Technology.” IMAPSource Proceedings 2017 (1): 406–10. https://doi.org/10.4071/isom-2017-WP33_029.