Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Design of Experiments Approach to Evaluating the Reliability of System-in-Package Assemblies
Timothy Dittman
,
David Ebner
,
Alex Bailey
,
Microelectronics
Microelectronic Packaging
System in Package
Integrated Circuit
Flip-chip
Reliability
•
https://doi.org/10.4071/isom-2017-THA52_063
IMAPSource Conference Papers
Dittman, Timothy, David Ebner, and Alex Bailey. 2017. “Design of Experiments Approach to Evaluating the Reliability of System-in-Package Assemblies.”
IMAPSource Proceedings
2017 (1): 619–23.
https://doi.org/10.4071/isom-2017-THA52_063
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats