Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Characterizations of Fan-out Wafer-Level Packaging
Characterizations of Fan-out Wafer-Level Packaging
Ming Li, Qingqian Li, John Lau, Nelson Fan, Eric Kuah, Wu Kai, Ken Cheung, Zhang Li, Kim Hwee Tan, Iris Xu, Dong Chen, Rozalia Beica, CT Ko, Henry Yang, Sze Pei Lim, Jiang Ran, Cao Xi,
Li, Ming, Qingqian Li, John Lau, Nelson Fan, Eric Kuah, Wu Kai, Ken Cheung, et al. 2017. “Characterizations of Fan-out Wafer-Level Packaging.” IMAPSource Proceedings 2017 (1): 557–62. https://doi.org/10.4071/isom-2017-THA31_057.