Characterizations of Fan-out Wafer-Level Packaging

Ming Li; Qingqian Li; John Lau; Nelson Fan; Eric Kuah; Wu Kai; Ken Cheung; Zhang Li; Kim Hwee Tan; Iris Xu; Dong Chen; Rozalia Beica; CT Ko; Henry Yang; Sze Pei Lim; Jiang Ran; Cao Xi

doi:10.4071/isom-2017-THA31_057

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Li, Ming, Qingqian Li, John Lau, Nelson Fan, Eric Kuah, Wu Kai, Ken Cheung, et al. 2017. “Characterizations of Fan-out Wafer-Level Packaging.” IMAPSource Proceedings 2017 (1): 557–62. https://doi.org/10.4071/isom-2017-THA31_057.

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