INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES

G. Pares; J.-P. Michel; E. Deschaseaux; V. Pernin; A. Giry; P. Ferris; A. Serhan

doi:10.4071/isom-2017-TP32_061

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Pares, G., J.-P. Michel, E. Deschaseaux, V. Pernin, A. Giry, P. Ferris, and A. Serhan. 2017. “INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES.” IMAPSource Proceedings 2017 (1): 72–77. https://doi.org/10.4071/isom-2017-TP32_061.

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