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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds

Michael David Hook, Michael Mayer, Stevan Hunter,
Ball bondreliabilitycopper wirepad thicknesshigh temperatureautomotive
https://doi.org/10.4071/isom-2017-WP42_135
IMAPSource Conference Papers
Hook, Michael David, Michael Mayer, and Stevan Hunter. 2017. “High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds.” IMAPSource Proceedings 2017 (1): 432–37. https:/​/​doi.org/​10.4071/​isom-2017-WP42_135.
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