Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Investigation & Resolution of Current Leakage Failure caused by Carbon Black Aggregation in Mold Compound
Akhilesh Kumar Singh
,
Teck Beng Lau
,
Nishant Lakhera
,
Hoffmann James
,
Boon Yew Low
,
Carbon Black
Mold Compound
Current Leakage
Agglomeration
Particle
•
https://doi.org/10.4071/isom-2017-THP12_012
IMAPSource Conference Papers
Singh, Akhilesh Kumar, Teck Beng Lau, Nishant Lakhera, Hoffmann James, and Boon Yew Low. 2017. “Investigation & Resolution of Current Leakage Failure Caused by Carbon Black Aggregation in Mold Compound.”
IMAPSource Proceedings
2017 (1): 685–88.
https://doi.org/10.4071/isom-2017-THP12_012
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats