Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical Applications
Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical Applications
Cardoso, André, Raquel Pinto, Elisabete Fernandes, and Steffen Kroehnert. 2017. “Implementation of Wafer Level Packaging KOZ Using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical Applications.” IMAPSource Proceedings 2017 (1): 569–75. https://doi.org/10.4071/isom-2017-THA34_118.