Vol. 2017, Issue 1, 2017October 01, 2017 EDT
14nm Chip Package Interaction (CPI) Technology Development
14nm Chip Package Interaction (CPI) Technology Development
Fu, Lei, YS Low, Milind Bhagavat, and Ivor Barber. 2017. “14nm Chip Package Interaction (CPI) Technology Development.” IMAPSource Proceedings 2017 (1): 331–35. https://doi.org/10.4071/isom-2017-WP12_054.