Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

Nishant Lakhera; Sandeep Shantaram; AR Nazmus Sakib

doi:10.4071/isom-2017-WA53_009

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Lakhera, Nishant, Sandeep Shantaram, and AR Nazmus Sakib. 2017. “Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses.” IMAPSource Proceedings 2017 (1): 304–11. https://doi.org/10.4071/isom-2017-WA53_009.

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