Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses
Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses
Lakhera, Nishant, Sandeep Shantaram, and AR Nazmus Sakib. 2017. “Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses.” IMAPSource Proceedings 2017 (1): 304–11. https://doi.org/10.4071/isom-2017-WA53_009.