Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

Nishant Lakhera, Sandeep Shantaram, AR Nazmus Sakib,
automotive reliability environmental stresses interfacial adhesion leadframe to epoxy mold compound adhesion
• https://doi.org/10.4071/isom-2017-WA53_009
IMAPSource Conference Papers
Lakhera, Nishant, Sandeep Shantaram, and AR Nazmus Sakib. 2017. “Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses.” IMAPSource Proceedings 2017 (1): 304–11. https://doi.org/10.4071/isom-2017-WA53_009.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system