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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

Nishant Lakhera, Sandeep Shantaram, AR Nazmus Sakib,
automotive reliabilityenvironmental stresses interfacial adhesionleadframe to epoxy mold compound adhesion
https://doi.org/10.4071/isom-2017-WA53_009
IMAPSource Conference Papers
Lakhera, Nishant, Sandeep Shantaram, and AR Nazmus Sakib. 2017. “Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses.” IMAPSource Proceedings 2017 (1): 304–11. https:/​/​doi.org/​10.4071/​isom-2017-WA53_009.
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