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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses
Nishant Lakhera
,
Sandeep Shantaram
,
AR Nazmus Sakib
,
automotive reliability
environmental stresses interfacial adhesion
leadframe to epoxy mold compound adhesion
•
https://doi.org/10.4071/isom-2017-WA53_009
IMAPSource Conference Papers
Lakhera, Nishant, Sandeep Shantaram, and AR Nazmus Sakib. 2017. “Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses.”
IMAPSource Proceedings
2017 (1): 304–11.
https://doi.org/10.4071/isom-2017-WA53_009
.
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